Gamp writes with this interesting snippet: “As microprocessors have shrunk, the wiring between them hasn’t always kept up. But engineers at the University of Illinois are changing that with a decades-old metalworking technique. It’s called electrodeposition. It’s basically the same process used in electroplating, but instead of depositing metal on a surface, as when trying to make a gold-plated piece of jewelry, the metal is deposited in a wire. ‘People weren’t thinking about how to fabricate a wire in three dimensional space,’ said Min-Feng Yu, a professor of mechanical science and engineering.”

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